| 摘要 |
A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.
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