Positive pressure hot bonder

摘要

There is provided a pressure bonding system for applying pressure onto at least one tile of a workpiece. This system comprises upper and lower gripper members each having first and second gripper ends. The second gripper ends are connected to each other. The first gripper ends are movable relative to each other to receive the workpiece therebetween. Moreover, an upper pressure applicator assembly is slidably engaged to the upper gripper member. The upper pressure applicator assembly is slidable along the upper gripper member between the first and second ends along a length of the workpiece. The workpiece is placed between the upper and lower gripper members with an edge thereof being adjacent the second gripper ends. The upper pressure applicator applies pressure to the tile(s) upon relative movement of the first ends towards the workpiece to a position adjacent the tile(s).