发明名称 |
Power semiconductor module |
摘要 |
A power semiconductor module contains a power component and a sensor component. The power component is disposed on a first substrate. The sensor component is electrically and/or mechanically insulated from the power component by being disposed on an individual, separate second substrate. In this manner, disturbances of the sensor system section caused by the power section and its operation can be avoided particularly reliably.
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申请公布号 |
US6835994(B2) |
申请公布日期 |
2004.12.28 |
申请号 |
US20020298396 |
申请日期 |
2002.11.18 |
申请人 |
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH & CO. KG |
发明人 |
KISTNER MICHAEL;DILLIG REINHOLD;RAITH SEBASTIAN;LODDENKOETTER MANFRED;BAYERER REINHOLD |
分类号 |
H01L23/34;H01L25/16;(IPC1-7):H01L29/00;H01L23/053;H05K1/18 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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