Circuit to conductively bond contact spots on a semiconductor chip to mounting connections has a straight and a bent bond wire connection

摘要

A circuit to conductively bond contact spots (11) on the front of a semiconductor chip (10) to mounting connections (12) or to contact spots on other chips comprises at least two bond wires (1,2) one under the other on a contact spot with one wire being straight and the other bent and leading to the same mounting connection or contact spot. An independent claim is also included for a connection process for the above.