发明名称 |
Dielectric composite material |
摘要 |
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
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申请公布号 |
US2004256731(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20030465155 |
申请日期 |
2003.06.19 |
申请人 |
MAO GUOPING;QU SHICHUN;LI FUMING B.;CLOUGH ROBERT S.;O'BRYAN NELSON B. |
发明人 |
MAO GUOPING;QU SHICHUN;LI FUMING B.;CLOUGH ROBERT S.;O'BRYAN NELSON B. |
分类号 |
C08L65/00;H01L23/498;H05K1/03;H05K3/46;(IPC1-7):H01L23/48 |
主分类号 |
C08L65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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