发明名称 Dielectric composite material
摘要 A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
申请公布号 US2004256731(A1) 申请公布日期 2004.12.23
申请号 US20030465155 申请日期 2003.06.19
申请人 MAO GUOPING;QU SHICHUN;LI FUMING B.;CLOUGH ROBERT S.;O'BRYAN NELSON B. 发明人 MAO GUOPING;QU SHICHUN;LI FUMING B.;CLOUGH ROBERT S.;O'BRYAN NELSON B.
分类号 C08L65/00;H01L23/498;H05K1/03;H05K3/46;(IPC1-7):H01L23/48 主分类号 C08L65/00
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