| 摘要 |
A hybrid non-abrasive electrical test contact is taught. Unlike cantilever contacts of the prior art, the invention is able to contact a lead of an integrated circuit device under test without abrading the plating on the lead. This is achieved by the contact possessing multiple loops to allow the tip of the contact to move not only downwards, but also sideways in a rocking motion. The tip of the contact is also shaped to contact the lead at only one point so as not to affect the solderability of the lead. In addition, tests have shown that the contact of the present invention has at least twice the working life span compared to another contact of the prior art.
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