发明名称 |
Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material |
摘要 |
A method of polishing metal and barrier layer interconnect integrated with an extremely low dielectric constant material includes steps of (A) preparing a wafer composed of a copper layer and the extremely low dielectric constant material, (B) treating the copper layer chemically to produce a hard and brittle surface residual formed on the surface of the copper layer, (C) keeping polishing the surface residual by ultrasonic waves, (D) polishing a barrier layer of wafer by the ultrasonic waves, thereby polishing the wafer successfully.
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申请公布号 |
US2004259481(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20030617679 |
申请日期 |
2003.07.14 |
申请人 |
CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY |
发明人 |
PAN WEN-CHUEH;LAI JER-SHYONG;WANG YIH-HSING;FANN YANG-JIANN;CHU CHIH-WEI;CHUNG HSING-LIAO;HSU CHAUG-LIANG;TSAY MING-TSEH;JENG YEAU-REN;TSAI MENG-SHIUN |
分类号 |
B24B1/00;B24B1/04;B24B37/04;H01L21/321;(IPC1-7):B24B1/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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