| 摘要 |
The present invention is a system for controlling a pad conditioner in a CMP device. The system includes a roughness-sensing device mounted in proximity to a polishing pad. The roughness-sensing device generates an output responsive to a roughness of the polishing pad. A signal-processing unit then generates a roughness value of the polishing pad in response to the output from the roughness-sensing device, and generates a control signal in response to the generated roughness value. Finally, a control device controls motion of the pad conditioner in response to the control signal.
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