发明名称 |
Method to reduce adhesion between a conformable region and a pattern of a mold |
摘要 |
The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.
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申请公布号 |
US2004256764(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20030463396 |
申请日期 |
2003.06.17 |
申请人 |
UNIVERSITY OF TEXAS SYSTEM BOARD OF REGENTS;MOLECULAR IMPRINTS, INC. |
发明人 |
CHOI BYUNG JIN;XU FRANK Y.;STACY NICHOLAS A.;TRUSKETT VAN NGUYEN;WATTS MICHAEL P.C. |
分类号 |
B29C;B29C59/00;G03F7/00;(IPC1-7):B29C59/00 |
主分类号 |
B29C |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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