| 摘要 |
<p>A device for placing, and holding for dipping a flat metal body into an electroplating bath, especially a copper plate, comprises a cooling element on its rear side with an adapter having a break on the front side of a baffle and on its rear side a removeable housing. A device for placing, and holding for dipping a flat metal body into an electroplating bath, especially a copper plate, comprises a cooling element on its rear side with an adapter having a break on the front side of a baffle and on its rear side a removeable housing. The baffle and housing are liquid tight, and only the front side of the part of the metal body projecting from the adapter plate is exposed.</p> |
