发明名称 Laminated electronic component
摘要 A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.
申请公布号 US2004256714(A1) 申请公布日期 2004.12.23
申请号 US20040860133 申请日期 2004.06.04
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KITAJIMA HIROMICHI;OGAWA KEIJI;KATO MITSUHIDE
分类号 H01G2/24;H01L23/498;H01L23/544;H05K1/02;H05K1/11;H05K3/46;(IPC1-7):H01L23/053;H01L21/476 主分类号 H01G2/24
代理机构 代理人
主权项
地址