发明名称 |
Laminated electronic component |
摘要 |
A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate. |
申请公布号 |
US2004256714(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20040860133 |
申请日期 |
2004.06.04 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KITAJIMA HIROMICHI;OGAWA KEIJI;KATO MITSUHIDE |
分类号 |
H01G2/24;H01L23/498;H01L23/544;H05K1/02;H05K1/11;H05K3/46;(IPC1-7):H01L23/053;H01L21/476 |
主分类号 |
H01G2/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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