PRESSURE CONTROLLED HEAT SOURCE AND METHOD FOR USING SUCH FOR RTP

摘要

The present invention is directed to a thermal device and a method for thermally processing a substrate. The thermal device comprises a container having a surface exposed to the substrate, wherein the container further comprising a heat source and a plurality of thermal shields situated between the surface exposed to the substrate and the heat source. The thermal shields are spaced from one another by a predetermined distance defining one or more gaps therebetween, wherein the predetermined distance is associated with a mean free path of a gas residing therein. Alternatively, the predetermined distance is variable. A pressure of a gas residing within the one or more gaps is controlled, wherein the pressure of the gas switches the thermal conductivity of the gas between generally conductive and generally non-conductive.