发明名称 |
Semiconductor arrangement has integrated structure surrounded by protective structure to prevent diffusion of minority carriers and a contact to the substrate |
摘要 |
<p>A semiconductor arrangement in a doped substrate (S) comprises an integrated structure with a surrounding protective arrangement that prevents minority carrier diffusion in or out and has a substrate contact to convey an electric potential between the integrated and protective structures that is wider than the integrated structure. An independent claim is also included for a production process for a substrate contact as above.</p> |
申请公布号 |
DE10320414(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
DE2003120414 |
申请日期 |
2003.05.07 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SOMMER, MICHAEL BERNHARD |
分类号 |
H01L23/58;H01L23/62;H01L27/02;H01L29/06;H01L29/45;H01L29/861;(IPC1-7):H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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