发明名称 Semiconductor arrangement has integrated structure surrounded by protective structure to prevent diffusion of minority carriers and a contact to the substrate
摘要 <p>A semiconductor arrangement in a doped substrate (S) comprises an integrated structure with a surrounding protective arrangement that prevents minority carrier diffusion in or out and has a substrate contact to convey an electric potential between the integrated and protective structures that is wider than the integrated structure. An independent claim is also included for a production process for a substrate contact as above.</p>
申请公布号 DE10320414(A1) 申请公布日期 2004.12.23
申请号 DE2003120414 申请日期 2003.05.07
申请人 INFINEON TECHNOLOGIES AG 发明人 SOMMER, MICHAEL BERNHARD
分类号 H01L23/58;H01L23/62;H01L27/02;H01L29/06;H01L29/45;H01L29/861;(IPC1-7):H01L23/58 主分类号 H01L23/58
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