发明名称 |
APPARATUS FOR SPIN DRYING WAFER HAVING BUMPERS WITH REPLACEABLE AND DAMAGE-LESS FIXING PIN |
摘要 |
PURPOSE: An apparatus for a spin drying wafer having bumpers is provided to restrain a fixing pin from being deformed or damaged due to corrosion and to replace easily an old fixing pin with a new one by improving the structure of the fixing pin and using a stainless steel as a main material of the fixing pin. CONSTITUTION: An apparatus for a spin drying wafer includes a spindle assembly, a wafer support part, fingers, an L type member and a fixing pin. The spindle assembly(110) includes a spindle shaft(112) and a head(114). The wafer support part(120) includes a plurality of arms(124). The wafer support part is loaded on the spindle assembly. The finger(130) is protruded from an end of each arm. The L type member(160) is connected with a wafer bumper(170) at one end and includes a connection portion(162) at the other end. The connection portion includes an insertion hole for inserting the finger and screw holes penetrating through a wall of the connection portion. A fixing pin(190) is inserted into the screw hole to fix the finger and the L type member to each other. The fixing pin is made of a stainless steel.
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申请公布号 |
KR20040108224(A) |
申请公布日期 |
2004.12.23 |
申请号 |
KR20030039130 |
申请日期 |
2003.06.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HYEONG YEOL |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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