发明名称 APPARATUS FOR SPIN DRYING WAFER HAVING BUMPERS WITH REPLACEABLE AND DAMAGE-LESS FIXING PIN
摘要 PURPOSE: An apparatus for a spin drying wafer having bumpers is provided to restrain a fixing pin from being deformed or damaged due to corrosion and to replace easily an old fixing pin with a new one by improving the structure of the fixing pin and using a stainless steel as a main material of the fixing pin. CONSTITUTION: An apparatus for a spin drying wafer includes a spindle assembly, a wafer support part, fingers, an L type member and a fixing pin. The spindle assembly(110) includes a spindle shaft(112) and a head(114). The wafer support part(120) includes a plurality of arms(124). The wafer support part is loaded on the spindle assembly. The finger(130) is protruded from an end of each arm. The L type member(160) is connected with a wafer bumper(170) at one end and includes a connection portion(162) at the other end. The connection portion includes an insertion hole for inserting the finger and screw holes penetrating through a wall of the connection portion. A fixing pin(190) is inserted into the screw hole to fix the finger and the L type member to each other. The fixing pin is made of a stainless steel.
申请公布号 KR20040108224(A) 申请公布日期 2004.12.23
申请号 KR20030039130 申请日期 2003.06.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HYEONG YEOL
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址