ELECTROLESS GOLD PLATING SOLUTION

摘要

An electroless gold plating solution with which a gold plating film free of pitting corrosion at its surface can be obtained, which gold plating film when soldered realizes satisfactory soldering strength. In particular, an electroless gold plating solution characterized by containing a water soluble compound of gold and further containing as a reducing agent a hydroxyalkylsulfonic acid of the following general formula or salt thereof and an amine compound. (wherein R represents any of hydrogen, carboxyl, substituted or unsubstituted phenyl, naphthyl, saturated or unsaturated alkyl, acetyl, acetonyl, pyridyl and furyl; X represents any of hydrogen, Na, K and NH4; and n is an integer of 0 to 4.)