| 发明名称 |
Constructing of an electronic assembly having a decoupling capacitor |
| 摘要 |
An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder balls are soldered to electric lands on the motherboard.
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| 申请公布号 |
US2004256133(A1) |
申请公布日期 |
2004.12.23 |
| 申请号 |
US20030465214 |
申请日期 |
2003.06.18 |
| 申请人 |
DISHONGH TERRANCE J.;PEARSON TOM E. |
发明人 |
DISHONGH TERRANCE J.;PEARSON TOM E. |
| 分类号 |
H01L23/498;H01L23/50;H05K1/02;H05K1/14;H05K3/34;H05K7/10;(IPC1-7):H02G3/08 |
主分类号 |
H01L23/498 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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