| 摘要 |
<p>A method for reducing dimensions of a resist pattern on a substrate surface which comprises the steps of: (a) coating a patterned resist layer with an aqueous coating solution containing a water-soluble resin, which is a copolymer of (meth)acrylic acid and an ethylenically unsaturated monomeric compound selected from N-vinylpyrrolidone, N-vinylimidazolidinone, methyl acrylate, methyl methacrylate, N,N-dimethylacrylamide, N,N-dimethylaminopropyl methacrylamide, N,N-dimethylaminopropyl acrylamide, N-methylacrylamide, diacetoneacrylamide, N,N-dimethylaminoethyl methacrylate, N,N-diethylaminoethyl methacrylate, N,N-dimethylaminoethyl acrylate and N-acryloylmorpholine; (b) drying the coating layer to form a dried coating layer of the water-soluble resin; (c) subjecting the dried coating layer to a heat treatment to effect thermal shrinkage of the coating layer and reduction of dimensions of the resist pattern; and (d) dissolving away the coating layer by washing with water.</p> |
