System for and method of interconnecting high-frequency transmission lines

摘要

A cut via (116) is formed in an end of a multilayer circuit board (106) of the first transmission line (108), and a clearance (120) is provided between the cut via (116) and a ground pattern (102) for achieving an impedance matching between the first and second transmission lines (108, 114). The cut via (116) of a first transmission line (108) which may be a stripline or a microstrip line, and an electrode (112) of the second transmission line (114) are connected to each other, and ground patterns (102, 122) of the first and second transmission lines (108, 114) are connected to each other. The first and second transmission lines (108, 114) have respective signal lines (104, 110) positioned substantially coaxially with each other.