发明名称 Interposer assembly
摘要 An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact is formed from a length of cylindrical preplated metal wire having a small diameter. Interposer assemblies with contacts formed from small diameter wire contacts have reduced contact inductance and permit reduction of the thickness of the dielectric plate and of the spacing between adjacent contacts on the plate.
申请公布号 US6832917(B1) 申请公布日期 2004.12.21
申请号 US20040760067 申请日期 2004.01.16
申请人 INTERCON SYSTEMS, INC. 发明人 NEIDICH DOUGLAS A.
分类号 H01R12/04;H01R12/16;H01R13/03;H01R13/24;H01R43/20;(IPC1-7):H01R12/00 主分类号 H01R12/04
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