High performance cooling device with side mount fan

摘要

A side flow cooling device is disclosed. The side flow cooling device includes a heat mass with arms extending therefrom and a mounting surface for connecting the heat mass with a component to be cooled. The heat mass and the arms include a plurality of fins extending outward therefrom and aligned with a vertical axis of the heat mass. The fins have cooling surfaces and a slot between adjacent fins that are aligned with a longitudinal axis of the heat mass. A fan or the like can be connected with a side face of the cooling device to generate an air flow that is substantially along the longitudinal axis. The air flow wets over the cooling surfaces of the fins, on exposed portions of the heat mass, and on exposed portions of the arms to dissipate heat from the heat mass. The heat mass is not covered by the fan and therefore the fins can populate a substantial portion of a surface area of the heat mass thereby increasing the surface area available for cooling.