发明名称 |
Structure and method of forming a multiple leadframe semiconductor device |
摘要 |
A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coupled to the second semiconductor die and a second lead (30, 35) mounted to the lead of the first leadframe.
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申请公布号 |
US6833290(B2) |
申请公布日期 |
2004.12.21 |
申请号 |
US20030374630 |
申请日期 |
2003.02.27 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C. |
发明人 |
KNAPP JAMES H.;ST. GERMAIN STEPHEN C. |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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