发明名称 Copper clad laminate
摘要 There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.
申请公布号 US6833198(B2) 申请公布日期 2004.12.21
申请号 US20020203837 申请日期 2002.08.14
申请人 NIKKO MATERIALS COMPANY, LIMITED 发明人 SAKAMOTO MASARU;KITANO KOUJI
分类号 B23K26/00;B23K26/38;B23K101/42;C25D7/06;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):B32B15/08;B32B3/24;B23K26/18 主分类号 B23K26/00
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