发明名称 |
Dicing method for micro electro mechnical system chip |
摘要 |
A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).
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申请公布号 |
US6833288(B2) |
申请公布日期 |
2004.12.21 |
申请号 |
US20030412465 |
申请日期 |
2003.04.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG JOON SEOK;JUNG SUNG CHEON;YOON SANG KEE;LEE HYUN KEE |
分类号 |
B81B7/02;B81C1/00;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
B81B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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