发明名称 Semiconductor module with serial bus connection to multiple dies
摘要 A semiconductor module is provided which includes a beat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.
申请公布号 US6833984(B1) 申请公布日期 2004.12.21
申请号 US20020071298 申请日期 2002.02.07
申请人 RAMBUS, INC. 发明人 BELGACEM HABA
分类号 H01L23/36;H01L23/538;H01L25/065;(IPC1-7):H02H9/00 主分类号 H01L23/36
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