发明名称 |
Substrate processing system and substrate processing method |
摘要 |
A substrate-processing system has several processing units, a loading/unloading section for transferring wafers to be processed to each unit and taking out processed wafers from each unit and a sub-arm mechanism for receiving/transferring the substrates from/to the loading/unloading section and transferring the substrates one by one to each unit. The processing units and the sub-arm mechanism are controlled by a controller so that each unit processes the substrates one by one in accordance with a one-cycle time that is the maximum period among periods t1/m to tn/m obtained by dividing periods t1 to tn by the number "m" of identical units of each processing unit. The controller sets a pre-waiting time (before processing) for each processing unit.
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申请公布号 |
US6834210(B2) |
申请公布日期 |
2004.12.21 |
申请号 |
US20010014855 |
申请日期 |
2001.12.14 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TATEYAMA MASANORI;MIYATA AKIRA |
分类号 |
G03F7/30;B65H1/00;H01L21/00;H01L21/02;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):G06F19/00 |
主分类号 |
G03F7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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