发明名称 Substrate processing system and substrate processing method
摘要 A substrate-processing system has several processing units, a loading/unloading section for transferring wafers to be processed to each unit and taking out processed wafers from each unit and a sub-arm mechanism for receiving/transferring the substrates from/to the loading/unloading section and transferring the substrates one by one to each unit. The processing units and the sub-arm mechanism are controlled by a controller so that each unit processes the substrates one by one in accordance with a one-cycle time that is the maximum period among periods t1/m to tn/m obtained by dividing periods t1 to tn by the number "m" of identical units of each processing unit. The controller sets a pre-waiting time (before processing) for each processing unit.
申请公布号 US6834210(B2) 申请公布日期 2004.12.21
申请号 US20010014855 申请日期 2001.12.14
申请人 TOKYO ELECTRON LIMITED 发明人 TATEYAMA MASANORI;MIYATA AKIRA
分类号 G03F7/30;B65H1/00;H01L21/00;H01L21/02;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):G06F19/00 主分类号 G03F7/30
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