| 摘要 |
An enclosure is disclosed for housing multiple electronic devices. In one embodiment, the enclosure includes a chassis having a floor and opposing sidewalls. Discrete first and second midplanes, each having an opening formed therein, may be disposed in an interior portion of the chassis on opposite sides of a divider wall. The first and second midplanes may be configured to mate to at least one air displacement unit on a back surface of the associated midplane and to mate to at least one device sled on a front surface of the associated midplane. An opening is formed in each midplane adjacent the associated air displacement unit to permit air to pass through the opening.
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