| 摘要 |
PURPOSE: A semiconductor device, a package structure thereof and a manufacturing method thereof are provided to mount three-dimensionally a semiconductor chip and passive elements and to obtain multi-function from the semiconductor device at low costs without the increase of size by using properly insulating layers. CONSTITUTION: A semiconductor device includes a silicon substrate(1), a first to third insulating layer, face-up active elements, face-up passive elements, metal lines and external connection electrodes. The active elements and the passive elements are coated with the first and second insulating layers(11,21) on the silicon substrate. Metal lines for contacting the active and/or passive elements are formed thereon. The external connection electrodes(45) are formed on the metal lines via the third insulating layer(44) with metal posts(43). |
