发明名称 TFT WITH REDUCED INTERFACIAL STATE DENSITY BETWEEN ACTIVE LAYER AND GATE INSULATING LAYER AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A TFT(Thin Film Transistor) and a manufacturing method thereof are provided to reduce interfacial state density between an active layer made of non-single crystal germanium and a gate insulating layer by using a zirconium oxide or a hafnium oxide as a material for the gate insulating layer. CONSTITUTION: An active layer(2) is formed on a substrate(1), wherein the active layer is made of a non-single crystal germanium layer. A gate oxide layer(3) is formed on the active layer. At this time, the gate oxide layer is substantially made of one selected from a group consisting of a zirconium oxide and hafnium oxide.</p>
申请公布号 KR20040107381(A) 申请公布日期 2004.12.20
申请号 KR20040042426 申请日期 2004.06.10
申请人 CANON KABUSHIKI KAISHA 发明人 SHIMADA, TETSUYA;YONEHARA, TAKAO
分类号 H01L21/336;H01L29/49;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L21/336
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