METHOD FOR BONDING ANODE BY USING CAP FOR PREVENTING SHORT CIRCUIT BY SHIELDING METAL FROM UPPER ELECTRODE

摘要

PURPOSE: A method for bonding an anode by using a cap is provided to prevent a short circuit from being generated while bonding the anode by shielding a contact between a metal and an upper electrode using a nonconductor cap. CONSTITUTION: A method for bonding an anode includes a step of separately forming a lower anode bonding layer(30), an upper anode bonding layer(31), and a cap(32). The lower anode bonding layer(30) includes a conductive plate having a predetermined thickness. The upper anode bonding layer(31) is formed by filling a metal into a hole after the hole is formed by etching one portion of a nonconductor forming the upper anode bonding layer(31). The cap(32) includes a plate made from an insulating material. The upper anode bonding layer(31) is stacked on the lower anode bonding layer(30), and the cap(32) is stacked on the upper anode bonding layer(31).