| 摘要 |
<p>PURPOSE:To obtain a semiconductor lead shaping device which eliminates a hydraulic mechanism, variably provides a pressing speed, obviates the necessity of contacting it at a stopper at a bottom dead point, and obtain small noise and impact by providing a driver for driving a crankshaft at a variable speed, an elevational movement converter, a molding unit, and a bottom dead point regulator for regulating the bottom dead point of the converter. CONSTITUTION:A semiconductor lead shaping device for shaping semiconductor leads by elevationally moving shaping metal molds 101 has drivers 5, 6 for driving a crankshaft 1 at a variable speed, elevational movement converters 3, 4, 8 for converting the rotary motion of the shaft 1 driven by the drivers 5, 6 to upward or downward linear motion, a shaping unit operating the molds 101 by the elevational movements obtained by the converters 3, 4, 8, and a bottom dead point regulator 15 for regulating the bottom dead points of the converters 3, 4, 8. The regulation of the bottom dead point is conducted, for example, by driving a stepping motor 24 to rotate via a worm 23 a worm wheel 22, rotating a screw shaft 10 through a spline shaft 21, and elevationally moving a screw holder nut 11 together with a slide plate 12.</p> |
