| 摘要 |
PURPOSE:To automate laser laser beam machining by only inputting bits of information other than plate thicknesses by storing laser beam machining conditions according to material and plate thicknesses of materials to be machined and retrieving the optimum conditions based on plate thicknesses calculated from the height positions of machining heads and the bits of information other than plate thicknesses to control laser beam machining. CONSTITUTION:Plate thicknesses of the materials 17 and 18 to be machined are calculated automatically from the height positions of the machining heads 16 in a state opposed to the materials 17 and 18 to be machined to determine plate thicknesses T1 and T2 of the materials 17 and 18 to be machined. On the other hand, a keyboard 4 is operated to input the material and other bits of machining information other than plate thicknesses of the materials 17 and 18 to be machined to a machining condition retrieving part 21. The machining condition retrieving part 21 retrieves the optimum machining conditions in accordance with the materials 17 and 18 to be machined based on the plate thickness information of the materials 17 and 18 to be machined. Various memories are then retrieved to determine the machining conditions. Based on these respective determined values, a machining condition determining control part 5 controls machining operation of the title laser beam machine 1. |
