| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability without infiltration of moisture of an external atmosphere into a hermetically sealed semiconductor element. SOLUTION: A semiconductor device 10 includes an insulating base 1 having a recess part 1a formed to house a semiconductor element 3 on an upper surface, wiring conductors 2 formed from the inner surface of the recess 1a to at least one of the side face and the lower surface of the insulating base 1, the semiconductor element 3 placed on the bottom of the recess 1a of the insulating base 1 with an electrode 4 electrically connected to the wiring conductors 2, and a cover 5 mounted on the upper surface of the insulating base 1 covering the recess 1a by a resin adhesive 7. The exposed surface out of the resin adhesive 7 is covered with a water repellent resin layer 8. COPYRIGHT: (C)2005,JPO&NCIPI |
