| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing case of an electronic circuit substrate which does not damage a solder connection part of an electronic component even if vibration of a substrate and thermal expansion of a resin are generated while reducing a charge resin amount and improves heat dissipation property of the electronic component mounted on both sides of the substrate by performing resin molding for them. SOLUTION: The space for housing a substrate (12) is divided into a resin charge region (20) and a non-resin charge region (22). Among electronic components (34, 36) mounted on one surface (12a) of the substrate, the electronic component (34) which requires heat dissipation is arranged in the resin charge region and subjected to resin molding, and a through-hole (40) is shaped in a portion in contact with the resin charge region of the substrate. Therefore, when the substrate is housed in a housing case (10), a resin (48) put in the resin charge region is made to flow out to the other surface of the substrate through the through-hole and an electronic component (44) which requires heat dissipation mounted on the other surface is subjected to resin molding. COPYRIGHT: (C)2005,JPO&NCIPI |
