<p>A photosensitive transparent resin film, provided selectively with a groove reaching a transparent substrate is formed on the transparent substrate, and a wiring part is provided in the groove substantially in flush with the photosensitive transparent resin film. The wiring part can be formed quickly while controlling the thickness easily by preprocessing the surface of the photosensitive transparent resin film or the bottom face of the groove before the wiring part is set in the groove.</p>
