| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure composed of a semiconductor device, a relay board, and a board with a low rate of occurrence of short-circuit failure and high reliability at a relatively low cost. <P>SOLUTION: A structure 11 comprises a semiconductor device 21, a relay board 31, and a board 41. The semiconductor device 21 has a coefficient of thermal expansion of not less than 2.0 ppm/°C and less than 5.0 ppm/°C and a surface connection terminal 22. The board 41 has a coefficient of thermal expansion of not less than 5.0 ppm/°C and a surface connection pad 46. The relay board 31 has a relay board body 38 and a plurality of conductive columns 35. On a first surface 32 of the relay board body 38, the semiconductor device 21 is mounted and a second surface 33 is mounted on the surface of the board 41. At the ends at the first surface side of the plurality of conductive columns 35, relay board-side solder bumps 36 are arranged, while at the ends on the second surface side, the relay board-side solder bump 36 is not arranged. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
