| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring board by which a wiring board that is reduced in cross talk noise and provided with coaxial through holes capable of making impedance matching can be manufactured easily by securing high insulation reliability and connection reliability. <P>SOLUTION: This method includes a step of coaxially forming a center fine hole 5 and external cylindrical holes 6 into a core substrate 2 by plasma etching from one surface of the substrate 2, a step of forming diffusion-of-conductive-substance preventing layers 7a and 7b and base conductive layers 8a and 8b on the internal wall surfaces of the holes 5 and 6, and a step of packing conductive substances 9a and 9b in the holes 5 and 6. The method also includes a step of forming a center through hole 5 and external through holes 6 by exposing the packed conductive substances 9a and 9b by polishing the surface of the substrate 2; a step of forming via holes connected to the conductive substance 9a packed in the center through hole 5 and, in addition, insulated from the conductive substance 9b packed in the external through holes 6 and, at the same time, forming wiring through an electrical insulating layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
