| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board for mounting electronic components at high density, an electronic device employing it in which the size and profile can be reduced while enhancing manufacturing efficiency and connection stability, and to provide its manufacturing process. <P>SOLUTION: A plurality of unburned substrate sheets 61-1 to 61-n provided with vias and a wiring pattern are laid in layers and then burned while being pressed by means of pressure plates 62 and 63 where recesses 101 formed at a depth corresponding to the height of bump electrodes being formed in a pattern corresponding to that of the bump electrodes is filled with a conductive material thus integrating the plurality of substrate sheets 61-1 to 61-n. The pressure plates 62 and 63 are then stripped from the plurality of integrated substrate sheets 61-1 to 61-n thus producing a circuit board having bump electrodes projecting at least more than the thickness of a conductive film from the surface of the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
