| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer insulating film-forming resin composition for use with multilayer wiring boards, low in dielectric constant, and low in dielectric loss in the high-frequency range. SOLUTION: The interlayer insulating film-forming resin composition for use in multilayer wiring boards contains (A) a polymer comprising vinylbenzene and/or monomer units originating in its derivative and/or comprising vinylnaphthalene and/or monomer units originating in its derivative, (B) at least one compound selected from the group consisting of a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound, and a (vinylphenyl) vinyl ether compound, and (C) a cationic curing catalyst. COPYRIGHT: (C)2005,JPO&NCIPI |
