MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE MANUFACTURED WITH THEM

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, to provide a semiconductor substrate whose manufacturing cost is reduced by abolishing alignment to a pn column without forming an additional layer, in manufacture of the semiconductor device of high breakdown voltage/low on-resistance having the pn column, and to provide a low-cost semiconductor device manufactured with them. SOLUTION: This method comprises: a forming step for forming the pn column which has a strip shape in a cross-sectional surface of a substrate, and further has a repeat pattern of p-conductive types and n-conductive types in a substrate surface, extending over the entire region 1pn in a semiconductor substrate 1 where a plurality of the same semiconductor substrates 100 are formed; a step for forming a residual component of a plurality of the same semiconductor devices 100 in the region 1pn in which the repeat pattern exists, with the pn column as a part of the component of the semiconductor device 100; and a step for cutting individual semiconductor device 100 into a chip from the region 1pn where a plurality of the same semiconductor devices 100 are formed. COPYRIGHT: (C)2005,JPO&NCIPI