| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing method arranged to prevent intrusion of contaminants and fine dusts into a curing furnace by discharging contaminants and fine dusts intruding into the curing furnace as a TCP tape is carried in immediately in the vicinity of the inlet, and to provide a semiconductor chip produced by that method. SOLUTION: In resin sealing equipment for forming a protective layer by dripping resin onto the surface of a semiconductor chip bonded to a TCP tape, a duct for exhausting a curing furnace disposed in the resin sealing equipment is formed in the vicinity of the inlet of the curing furnace in order to prevent intrusion of contaminants into the curing furnace. COPYRIGHT: (C)2005,JPO&NCIPI
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