发明名称 MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of reducing the influence of electromagnetic waves generated from other electronic circuits located in the vicinity of wirings forming a wiring pattern. SOLUTION: In the multilayer wiring board where a plurality of wiring patterns are laminated one another via an insulating layer, a plurality of columnar members 4 each comprising a conductor penetrating the insulating layer is provided on at least one of the two insulating layers 3, 3a laminated on both sides of the wiring pattern. The columnar member 4 is provided on both sides of the wiring 2 forming the wiring pattern with a predetermined interval. An interval between the wiring 2 and the columnar member 4 preferably falls within the range of 10 to 500μm. Further, the plurality of the columnar members 4 are provided with a predetermined interval in the length direction of the wiring 2. At this point, it is preferable to arrange the columnar members 4 with an interval of 10 to 500μm each other. Further, the columnar member 4b or the second wiring 2a may be laminated on the surfaces of the insulating layers 3, 3a. The columnar members 4, 4b are formed of a laser via or a bump for example. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356483(A) 申请公布日期 2004.12.16
申请号 JP20030154141 申请日期 2003.05.30
申请人 CLOVER DENSHI KOGYO KK 发明人 FUJISAWA SHOJI;OGASAWARA MASARU
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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