发明名称 PATTERN MEASURING METHOD, PATTERN MEASURING DEVICE, AND PATTERN MEASURING PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a pattern measuring method, a pattern measuring device, and a pattern measuring program for accurately extracting a contour of an optionally shaped defect produced at an optional position on a pattern. SOLUTION: The pattern measuring method includes the steps of capturing image data obtained from an object to be measured having a defective part 31; using a rectangle in a manner of surrounding the defective part 31 to set a first measurement object region 34; using an ellipse in a manner of surrounding the defective part in the inside of the first measurement object region 34 to set a second measurement object region 35; setting a first rectangular division 36 which circumscribes the ellipse; setting second and third semielliptic divisions 38, 39 within the rectangle, the center of each semiellipse being a point of contact between the ellipse and the rectangle; setting first and second rectangular searching regions 41, 42, third and fourth sectorial searching regions 43, 44, and a fifth semielliptic searching region 45 within the first measurement object region 34 in a manner of including the defective part 31 wherein the regions 41 to 45 are not overlapped with each other; searching pattern edges in the set searching directions; and connecting the pattern edges. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356446(A) 申请公布日期 2004.12.16
申请号 JP20030153398 申请日期 2003.05.29
申请人 TOSHIBA CORP 发明人 IKEDA TAKAHIRO
分类号 G01B11/24;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01B11/24
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