发明名称 TARGET FOR MAGNETRON SPUTTERING
摘要 PROBLEM TO BE SOLVED: To provide a target for magnetron sputtering in which the sputtering rate in the corner part can be made equal to that in the straight line part even when the conventional magnetron sputtering system is used, and which can effectively be consumed at least in the truck-shaped elliptical part, and allows to widen an effective range where film is deposited so as to have a uniform film thickness. SOLUTION: In the target for magnetron sputtering, both the end parts of the short side in the target 11 are provided with magnetic materials 12 for reducing magnetic force, which is rectangular, wherein the short side length of the target is the width, and the range from the short side edge to the straight line position of erosion is almost the length. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004353020(A) 申请公布日期 2004.12.16
申请号 JP20030150485 申请日期 2003.05.28
申请人 TOPPAN PRINTING CO LTD 发明人 NONAKA SHIGEJI;MIZOBUCHI NOBUYOSHI;NAKAMURA ATSUTAKA
分类号 C23C14/35;C23C14/34;(IPC1-7):C23C14/35 主分类号 C23C14/35
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