发明名称 DEPOSITED FILM FORMATION DEVICE, AND DEPOSITED FILM FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a deposited film formation device and a deposited film formation method for making remarkable reduction of abnormal growth, enhancement of quality and cost reduction compatible with each other in high dimensions. SOLUTION: The deposited film formation device is provided with: a reaction vessel which has a cylindrical substrate disposed and which can be evacuated; an exhaust means; a gas feed means; and a high frequency power source. A substrate holder for installing the cylindrical substrate consists of a metallic cylinder. A part thereof is provided with a projecting part of a dielectric substance having a diameter larger than that of the cylindrical substrate. The projecting part is a part of a cone in which the diameter of the part far from the cylindrical substrate is larger and the diameter of the part closer to the cylindrical substrate is almost the same as that of the cylindrical substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004353059(A) 申请公布日期 2004.12.16
申请号 JP20030154635 申请日期 2003.05.30
申请人 CANON INC 发明人 AOKI MAKOTO;UEDA SHIGENORI;OZAWA TOMOHITO
分类号 G03G5/08;C23C16/458;H01L31/0248;(IPC1-7):C23C16/458;H01L31/024 主分类号 G03G5/08
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