REDUNDANT WIRE BONDS FOR INCREASING TRANSDUCER RELIABILITY

摘要

A method and a system for using redundant wire bonds for increasing the reliability of ultrasound transducers are disclosed. An ultrasound transducer assembly having an ultrasound transducer, an integrated circuit, a plurality of wires, and a plurality of bond pads is provided. The integrated circuit includes enlarged lead pads for receiving redundant wire bonds. The ultrasound transducer includes a plurality of bond pads configured to receive the redundant wire bonds. Connecting wires, forming signal paths, connect the enlarged lead pads with the bond pads.