| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of semiconductor device so that the high frequency characteristic when a semiconductor device comprising an optical semiconductor element is mounted to a mounting substrate can be improved and an apparatus such as communication apparatus finally obtained can be reduced in the thickness. <P>SOLUTION: In the mounting structure of semiconductor device, a semiconductor device comprising an optical semiconductor element 14 mounted to one surface side of a metal header 10 and a plurality of leads 16a, 16b, one end thereof is electrically connected to the optical semiconductor element 14 and header 10, and the other end thereof is projected from the other surface of the header 10, is mounted through connection with the pads 32, 32 or the like where the other end of a plurality of leads 16a, 16b is formed on the pattern forming surface of the mounting substrate 30. Moreover, an insulting layer 28 made of electrical insulating material is formed in the other surface side of the header 10. In addition, the semiconductor device is mounted to the mounting substrate 20 so that the insulating layer 28 is placed in contact with the side end surface orthogonally crossing the pattern forming surface of the mounting substrate 30 and the other ends of a plurality of leads 16a, 16b projected from the other surface side of the header 10 are linearly connected to the pads 32, 32 of the mounting substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
