| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package where the connection of a semiconductor element with an external electric circuit board is kept high enough in reliability in an environment where heat is repeatedly applied with the operation of the semiconductor element and the change of an operating environment, and to provide a semiconductor device. SOLUTION: The semiconductor element housing package is equipped with a resin board 1 with a mounting pad mounted with a semiconductor element 4 and located at the center of its top surface, a metal frame 2 which is fixed on the top surface of the resin board 1 surrounding the mounting pad, and a metal lid 3 which is stacked up on the top surface of the metal frame 2 fixing the periphery of its lower surface to the top surface of the metal frame 2 so as to cover the mounting pad. The thermal expansion coefficient of the resin board 1 is larger than that of the semiconductor element 4 and intermediate between those of the semiconductor element 4 and the metal frame 2. The thermal expansion coefficient of the metal frame 2 is larger than that of the metal lid 3, and a semiconductor device is provided using the above semiconductor element housing package. COPYRIGHT: (C)2005,JPO&NCIPI
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