METHOD OF MANUFACTURING MOUNTING BOARDS, INCLUDING STEPS OF SUPPLYING SOLDER, RECOGNIZING POSITION OF SUBSTRATE, DETERMINING POSITION OF FIRST ELECTRONIC COMPONENT AND MOUNTING SOLDER PUMP, RECOGNIZING POSITION OF FIRST ELECTRONIC COMPONENT, DETERMINING POSITION OF SECOND ELECTRONIC COMPONENT AND MOUNTING SOLDER PUMP, AND HEATING THE SUBSTRATE

摘要

PURPOSE: A method for fabricating mounting boards is provided to stack a plurality of electronic components on a substrate with a low cost. CONSTITUTION: A method comprises a step of supplying solder to a first electrode(3a) of a substrate(3); a step of recognizing position of the substrate; a step of determining position of a first electronic component(11) of a first stage on the substrate, based on the result of recognition, and mounting a solder pump(16) on the first electrode; a step of recognizing position of the first electronic component; a step of determining position of a second electronic component(12) of a second stage, based on the result of recognition of position of the first electronic component, and mounting a solder pump(18) on a second electrode(3b) formed on the first electronic component; and a step of heating the substrate on which the first electronic component and the second electronic component are mounted, to thereby soldering the first electronic component to the substrate and the second electronic component to the first electronic component.