METHOD OF MOUNTING ELECTRONIC PART, MOUNTING STRUCTURE OF ELECTRONIC PART, ELECTRONIC PART MODULE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method of mounting an electronic part, which is capable of electrically connecting the electronic part surely to a board.

SOLUTION: The board 60 is equipped with through-holes 63 extending from connecting electrodes 62 and 68 formed on its undersurface to its top surface and low-melting point metals 64 filling the through-holes 63. A bump 44 formed on the electrode pad 42 of an electronic part 40 is pressed on the upper end of the low-melting point metal 64 as the low-melting point metal 64 is heated, whereby the bump 44 and the low-melting point metal 64 are bonded together by alloying. Moreover, the active surface of the electronic part 40 is sealed up with the top surface of the board 60.

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