发明名称 SWITCHING ELEMENT MOUNTING STRUCTURE TO HEAT SINK
摘要 <P>PROBLEM TO BE SOLVED: To avoid a thermal influence on peripheral electronic components by positioning high-speed switching elements being high heat generation sources dispersedly and by preventing a deterioration in the heat radiation efficiency of a heat sink. <P>SOLUTION: A control board 20, which constitutes an ECU10, is equipped with switching elements 25a, 25b, 25c, 26a, 26b, and 26c which constitute a motor driving circuit for PWM-driving a motor. For these switching elements, high-speed switching elements 26a, 26b, and 26c and low-speed switching elements 25a, 25b, and 25c are attached, being arranged alternately, to the heat sink 27 fixed to the board 20a. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004357384(A) 申请公布日期 2004.12.16
申请号 JP20030150878 申请日期 2003.05.28
申请人 TOYODA MACH WORKS LTD 发明人 KOBAYASHI KOYO;WATANABE YUKIHIRO;ATOYAMA MITSUYA
分类号 H05K7/20;H01L23/40;H02M7/48;H02P6/04;H02P6/08 主分类号 H05K7/20
代理机构 代理人
主权项
地址